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Your search returned 29 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1991 Volume number : 14 Issue: 03 |
A Precision Vertical Interconnect Technology
(Article)
Subject:
Precision
,
Interconnect
,
Substrate
,
Contact Material
Author:
F
Matta
Michael
Greenstein
page:
445
-
451
Improving Manufacturing Reliability In Ic Package Assembly Using Fmea Technique
(Article)
Subject:
Manufacturing Improvements
,
Reliability
,
Ic Packages
,
Fmea
Author:
Shankara
Prasad
page:
452
-
456
Mechatronics, Systems, Elements, And Technology: A Perspective
(Article)
Subject:
Mechatronics
,
Systems
,
Elements
,
Perspective
Author:
L. Ken
Keys
Charles M.
Parks
page:
457
-
461
Fusion: A Plan For Developing A Familiar User System Interface For The Ic Fabrication Industry
(Article)
Subject:
Fusion
,
Plan For Developing
,
Familiar
,
Ic Fabrication Industry
Author:
Dwight P.
Miller
page:
462
-
466
Statistical Control Of Vlsi Fabrication Processes
(Article)
Subject:
Statistical Analysis
,
Vlsi
,
Fabrication
,
Processes Controlling
Author:
Purnendu K.
Mozumder
Andrzej J.
Strojwas
page:
467
-
475
Computer Integrated Manufacturing And Networking In Advanced Ic Manufacturing
(Article)
Subject:
Computer Integrated Inspection
,
Manufacturing
,
Networking
,
Ic Manufacturing Diagnosis Based
Author:
Sam L.
Sundaram
Jean B.
Hugues
page:
476
-
482
A Generic Computer Simulation Model To Characterize Photolithography Manufacturing Area In An Ic Fab Facility
(Article)
Subject:
Generic Computer Simulation Model
,
Characterize Photolithography
,
Manufacturing Area
,
Ic Fab Facility
Author:
Kowdle
Prasad
page:
483
-
487
Technology Development: Focus On Manufacturability
(Article)
Subject:
Technology Development
,
Focus
,
Manufacturability Analysis
,
Emi Filter
Author:
David J
Miller
Frank J.
Anastasio
page:
488
-
492
Spc And Setup Analysis For Screen Printed Thick Films
(Article)
Subject:
Spc
,
Screen Printing
,
Thick Films
,
Process Variable
Author:
Mayank R.
Parikh
William F.
Quilty
Keith M.
Gardiner
page:
493
-
498
Cept-A Computer-Aided Manufacturing Application For Managing Equipment Reliability And Availability In The Semiconductor Industry
(Article)
Subject:
Computer-Aided
,
Manufacturing
,
Reliability
,
Semiconductor Industry
Author:
Prasad
Rampalli
Arakere
Ramesh
Nimish
Shah
page:
499
-
506
Desorption Of Moisture From Stainless Steel Tubes And Alumina Filters In High Purity Gas Distribution Systems
(Article)
Subject:
Desorption
,
Stainless Steel (Ss)
,
Alumina Filters
,
High Purity Gas
Author:
Asad M.
Haider
Farhang
Shadman
page:
507
-
511
Statistical Design Techniques For High-Speed Circuit Boards With Correlated Structure Distributions
(Article)
Subject:
Statistical Design
,
High-Speed Circuits
,
Circuit Boards
,
Correlated Structure Distributions
Author:
N
Matsui
Tetsuo
Mikazuki
page:
512
-
517
Characterization Of A Jfet Operational Amplifier By Planned Experimentation And Its Impact On Ic Manufacturing
(Article)
Subject:
Characterization
,
Jfet Operational Amplifier
,
Ic Manufacturing Diagnosis Based
,
Impact Models
Author:
Arvid C.
Carlson
Sam L.
Sundaram
page:
518
-
522
Highly Reliable Au-Sn Eutectic Bonding With Background Gaas Lsi Chips
(Article)
Subject:
Reliable
,
Eutectic
,
Bonding
,
Gaas Lsi Chips
Author:
Masanori
Nishiguchi
Hideaki
Nishizawa
Noboru
Goto
page:
523
-
528
Short And Long Loop Manufacturing Feedback Using A Multisensor Assembly Test Chip
(Article)
Subject:
Feedback
,
Multisensor
,
Assembly
,
Short And Long Loop
Author:
Melanie R.
Tuck
James N.
Sweet
page:
529
-
535
Design Of Metallizations And Components For Aluminum Nitride Packages For Vlsic
(Article)
Subject:
Metallization
,
Components
,
Aluminum Nitride
,
Vlsic
Author:
Leonard E.
Dolhert
Jack H.
Enloe
Ellice Y.
Luh
page:
538
-
542
Improvements In Wire Bonding And Solderability Of Surface Mount Components Using Plasma Cleaning Techniques
(Article)
Subject:
Wire Bonding
,
Solder Reliability
,
Surface Mount Technology
,
Plasma
Author:
Ray D.
Rust
Daryl Ann
Doane
page:
573
-
579
Ac Complex Impedance Investigation For Ruo2-Glass Composites
(Article)
Subject:
Ac Impedance
,
Composite
,
Investigation
,
Complex
Author:
Ho Gi
Kim
Kwang Soo
No
Bon Keup
Koo
page:
580
-
584
Electrical Contact Phenomena Of Nickel Electrodeposits With Sharp Micro-Asperities
(Article)
Subject:
Electrical Contact
,
Phenomena
,
Nickel Electrode
,
Sharp Micro-Asperities
Author:
Joyee
Sapjeta
Clarence A.
Holden
Henry H.
Law
Glen R.
Crane
page:
585
-
591
Thick Film Resistor Fabricated With Yba2cu3o 7-X Superconducting Powder
(Article)
Subject:
Thick Film
,
Resistor
,
Fabrication
,
Superconducting Powder
Author:
Shen-Li
Fu
Yu-Hung
Hsieh
page:
592
-
596
Observations Of Electrical Contact Surface In Cu-Ag/Ni Couple With Make/Break
(Article)
Subject:
Oxidation
,
Cu-Ag, Ni
,
Contact Surface
,
Make/Break
Author:
Yasuo
Imada
Koichi
Nakajima
page:
597
-
601
Programs/Projects Management And Integrated Product/Process Development In High Technology Electronic Products Industries
(Article)
Subject:
Program Management
,
Project Management
,
Product/Process Development
,
High Technology Electronic Products Industries
Author:
L. Ken
Keys
page:
602
-
612
New Trimming Technology Of A Thick Film Resistor By The Pulse Voltage Method
(Article)
Subject:
Thick Film
,
Resistor
,
Pulse Voltage Method
,
New Trimming Technology
Author:
T
Tobita
Hayato
Takasago
page:
613
-
617
Transient Analysis Of Lossy Multiconductor Transmission Lines In Nonlinear Circuits
(Article)
Subject:
Transient Analysis
,
Nonlinear Circuits
,
Lossy Multiconductor
,
Transmission Lines
Author:
Raj
Mittra
Thomas S.
Blazeck
page:
618
-
627
Grain Boundary Sliding In Surface Mount Solders During Thermal Cycling
(Article)
Subject:
Grain Boundary
,
Sliding Systems
,
Surface Mount Technology
,
Thermal Cycle Stability
Author:
Donald S.
Stone
Seong-Min
Lee
page:
628
-
632
Surge Test Characteristics Of High K Multilayer Ceramic Capacitors
(Article)
Subject:
Surge
,
Multilayer Cermic Capacitor
,
Characteristics
Author:
David D.
Chang
Hung C.
Ling
page:
633
-
636
Analysis Of Alternative Rework Strategies For Printed Wiring Assembly Manufacturing Systems
(Article)
Subject:
Wiring
,
Analysis Of Alternative Rework Strategies
,
Printed Wiring
,
Assembly Manufacturing Systems
Author:
Morris R.
Driels
John S.
Klegka
page:
637
-
644
Development Of Temperature-Stable Thick-Film Dielectrics. Iii. Role Of Glass On The Microstructure Evolution Of A Thick-Film Dielectric
(Article)
Subject:
Temperature Stability
,
Thick Film
,
Dielectric
,
Microstructure-Evolution
Author:
Bi-Shiou
Chiou
Jenq-Gong
Duh
page:
645
-
649
The Effect Of High Current Density And Uneven Current Distribution On A Current Collection System
(Article)
Subject:
High Current Density
,
Current Distribution
,
Current Collectors
,
Nonhomogeneneous Media
Author:
Tommy W S
Chow
Herby W.
Bishop
page:
650
-
656
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